• High Tg Epoxy Resin-1 - KEB-3180
High Tg Epoxy Resin-1
Model - KEB-3180
Bisphenol A Novolac Epoxy
 
  • General Description
The KEB-3180, Bisphenol A novolac based epoxy resin, can give improved high temperature strength, heat stabilities, reaction and chemical resistance because of its multi-functional epoxy groups in a molecule. It also provides higher crosslinked property than general Bisphenol A type epoxy resin. KEB-3180 is a high molecular type of KEB series and can be used for high temperature adhesives, FR-5 type printed circuit board and high Tg for powder coating or laminates.
  • Chemical Structure
  • Resin Properties
  • Usage
  1. High temperature adhesives
  2. Electronic encapsulation and transfer molding
  3. Electrical heat resistance molding compounds
  4. High temperature reinforced plastics applications
  5. FR-5 type printed circuit board
  6. High Tg for powder coating and laminates
  • Storage
Keep in cool, dry, ventilate condition and in closed containers. Keep away from heat sources and direct sunlight. Recommended safe handing procedures are discussed in the information on the MSDS should reviewed and understood before working.
  • Packaging
Paper bag of 20 kg net weight

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